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| Parameter | Description | Value |
|---|---|---|
| Material | Base Material | FR-4 |
| Layer Count | Number of Layers | 4 Layers |
| Thickness | Overall Board Thickness | 1.6 mm |
| Surface Finish | Surface Treatment Type | HASL (Hot Air Solder Leveling) |
| Copper Weight | Copper Thickness | 1 oz |
| Minimum Traces | Width of Traces | 0.1 mm |
| Minimum Spacing | Spacing Between Traces | 0.1 mm |
| Via Type | Type of Via Used | Blind Via |
| Testing | Electrical Testing Type | Flying Probe Test |