Nā hoʻonā EMS no ka Papa Kaapuni Pai
wehewehe
Hoʻolako ʻia me ka mea SPI, AOI, a me X-ray no nā laina SMT 20, 8 DIP, a me nā laina hoʻāʻo, hāʻawi mākou i kahi lawelawe holomua e komo ana i kahi ākea o nā ʻenehana hui a hana i ka PCBA multi-layers, PCBA maʻalahi. Loaʻa i kā mākou hale hana ʻoihana ROHS, hāʻule, ESD, a me nā mea hoʻāʻo kiʻekiʻe & haʻahaʻa haʻahaʻa. Hāʻawi ʻia nā huahana āpau e ka mana koʻikoʻi. Ke hoʻohana nei i ka ʻōnaehana MES kiʻekiʻe no ka hoʻokele hana ʻana ma lalo o ke kūlana IAF 16949, mālama mākou i ka hana me ka paʻa.
Ma ka hoʻohui ʻana i nā kumuwaiwai a me nā ʻenekinia, hiki iā mākou ke hāʻawi pū i nā hoʻonā papahana, mai ka hoʻomohala ʻana i ka polokalamu IC a me ka lako polokalamu i ka hoʻolālā kaapuni uila. Me ka ʻike i ka hoʻomohala ʻana i nā papahana i ka mālama olakino a me ka uila uila, hiki iā mākou ke lawe i kāu mau manaʻo a hoʻokō i ka huahana maoli i ke ola. Ma ka hoʻomohala ʻana i ka polokalamu, ka papahana, a me ka papa ponoʻī, hiki iā mākou ke hoʻokele i ke kaʻina hana holoʻokoʻa no ka papa, a me nā huahana hope loa. Mahalo i kā mākou hale hana PCB a me nā ʻenekinia, hāʻawi ia iā mākou i nā pono hoʻokūkū i hoʻohālikelike ʻia me ka hale hana maʻamau. Ma muli o ka hoʻolālā huahana a me ka hui hoʻomohala, ke ʻano hana hana i hoʻokumu ʻia o nā nui like ʻole, a me ka kamaʻilio maikaʻi ma waena o ke kaulahao hoʻolako, ke hilinaʻi nei mākou e kū i nā pilikia a hoʻokō i ka hana.
| Hiki iā PCBA | |
| Lako 'akomi | wehewehe |
| Mīkini mākaʻikaʻi laser PCB500 | Kaha kaha: 400 * 400mm |
| Ka wikiwiki: ≤7000mm/S | |
| Ka mana nui: 120W | |
| Q-hoololi, Duty Ratio: 0-25KHZ; 0-60% | |
| Mīkini paʻi DSP-1008 | Nui PCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Ka nui Stencil: MAX:737*737mm MIN:420*520mm | |
| ʻO ke kaomi ʻokiʻoki: 0.5~10Kgf/cm2 | |
| ʻO ke ala hoʻomaʻemaʻe: hoʻomaʻemaʻe maloʻo, hoʻomaʻemaʻe pulu, hoʻomaʻemaʻe maloʻo (programmable) | |
| Ka wikiwiki paʻi: 6 ~ 200mm / sec | |
| Paʻi pololei: ± 0.025mm | |
| SPI | Ana kumu: 3D White Light PSLM PMP |
| Mea ana: Ka nui o ka paʻi solder, ʻāpana, kiʻekiʻe, XY offset, ʻano | |
| Hoʻonā lens: 18um | |
| Pono: XY hoʻonā: 1um; ʻO ka wikiwiki kiʻekiʻe: 0.37um | |
| Nānā nui: 40*40mm | |
| FOV māmā holo: 0.45s/FOV | |
| Mīkini SMT kiʻekiʻe SM471 | Nui PCB: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Ka helu o nā lāʻau kau: 10 spindles x 2 cantilevers | |
| Nui ʻāpana: Chip 0402(01005 ʻīniha) ~ □14mm(H12mm) IC, Mea hoʻohui (lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| ʻO ka pololei o ka kau ʻana: chip ±50um@3ó/chip, QFP ±30um@3ó/chip | |
| Ka māmā holo kau: 75000 CPH | |
| Mīkini SMT kiʻekiʻe SM482 | Nui PCB: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Ka helu o nā lāʻau kau: 10 spindles x 1 cantilever | |
| Nui o ka mea: 0402(01005 iniha) ~ □16mm IC, Mea hoʻohui (lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm) | |
| Ke kau pololei ʻana: ± 50μm@μ+3σ (e like me ka nui o ka chip maʻamau) | |
| Ka māmā holo kau: 28000 CPH | |
| HELLER MARK III Puhi Nitrogen reflux | Wahi: 9 wahi hoʻomehana, 2 ʻāpana hoʻoluʻu |
| Ke kumu wela: Hoʻoheheʻe ea wela | |
| ʻO ka pololei o ka mana wela: ± 1 ℃ | |
| Hiki ke uku wela: ±2 ℃ | |
| Orbital māmā: 180—1800mm/min | |
| Laulā laula o Track: 50—460mm | |
| AOI ALD-7727D | Ana kumu: Loaʻa i ka pahupaʻikiʻi HD ke kūlana noʻonoʻo o kēlā me kēia ʻāpana o ke kukui ʻekolu kala e hoʻomālamalama ʻia ma ka papa PCB, a hoʻoponopono iā ia ma ka hoʻohālikelike ʻana i ke kiʻi a i ʻole ka hana kūpono o nā waiwai hina a me RGB o kēlā me kēia kiko pika. |
| Mea ana: Nā hemahema paʻi paʻi paʻi, nā ʻāpana ʻāpana, nā hemahema hui solder | |
| Hoʻonā lens: 10um | |
| Pono: XY hoʻonā: ≤8um | |
| 3D X-RAY AX8200MAX | Nui ʻike kiʻekiʻe: 235mm*385mm |
| Ka mana nui: 8W | |
| ʻO ke kaha kiʻekiʻe loa: 90KV/100KV | |
| Nui ka nānā 'ana: 5μm | |
| Palekana (ʻano hoʻoheheʻe): ＜1uSv/h | |
| Ka nalu ʻana DS-250 | PCB laula: 50-250mm |
| Kiʻekiʻe hoʻoili PCB: 750 ± 20 mm | |
| Ka māmā holo: 0-2000mm | |
| Ka lōʻihi o ka wela wela: 0.8M | |
| Ka helu o ka ʻāpana wela mua: 2 | |
| Helu nalu: Ka nalu ʻelua | |
| Mīkini hoʻokaʻawale papa | Laulā hana: MAX:285*340mm MIN:50*50mm |
| ʻOki pololei: ± 0.10mm | |
| ʻOki wikiwiki: 0 ~ 100mm/S | |
| ʻO ka wikiwiki o ka hoʻololi ʻana o ka spindle: MAX: 40000rpm | |
| Hiki i ka ʻenehana | ||
| Helu | 'ikamu | Ka mana nui |
| 1 | mea kumu | Tg FR4 maʻamau, Tg FR4 kiʻekiʻe, PTFE, Rogers, Low Dk/Df etc. |
| 2 | Ka waihoʻoluʻu mask solder | ʻōmaʻomaʻo, ʻulaʻula, uliuli, keʻokeʻo, melemele, poni，ʻeleʻele |
| 3 | kala kalakala | keʻokeʻo, melemele, ʻeleʻele, ʻulaʻula |
| 4 | ʻAno lapaʻau ʻili | ENIG, Pīla kaiapuni, HAF, HAF LF, OSP, gula uila, manamana gula, kala kalaiwa |
| 5 | Max. papa-luna(L) | 50 |
| 6 | Max. nui ʻāpana (mm) | 620*813 (24"*32") |
| 7 | Max. ka nui o ka papa hana (mm) | 620*900 (24"x35.4") |
| 8 | Max. mānoanoa papa (mm) | 12 |
| 9 | Min. mānoanoa papa (mm) | 0.3 |
| 10 | Ka mānoanoa o ka papa (mm) | T<1.0 mm: +/-0.10mm ; T≥1.00mm: +/-10% |
| 11 | Ka hoʻopaʻa inoa ʻana (mm) | +/-0.10 |
| 12 | Min. anawaena puka wili mīkini (mm) | 0.15 |
| 13 | Min. anawaena puka wili laser (mm) | 0.075 |
| 14 | Max. hiʻohiʻona (ma loko o ka puka) | 15:1 |
| Max. hiʻohiʻona(micro-via) | 1.3:1 | |
| 15 | Min. ʻaoʻao puka i ke ākea keleawe (mm) | L≤10, 0.15；L=12-22,0.175；L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 |
| 16 | Min. kaʻawale o loko (mm) | 0.15 |
| 17 | Min. ʻaoʻao puka i kahi ʻaoʻao puka (mm) | 0.28 |
| 18 | Min. ʻaoʻao puka i ka laina laina kikoʻī (mm) | 0.2 |
| 19 | Min. ʻO ke keleawe i loko o ka laina laina sapce (mm) | 0.2 |
| 20 | Ka hoʻopaʻa inoa ʻana ma waena o nā puka (mm) | ±0.05 |
| 21 | Max. mānoanoa keleawe paʻa (um) | ʻĀpana waho: 420 (12oz) ʻĀpana Loko: 210 (6oz) |
| 22 | Min. laula ʻōlelo (mm) | 0.075 (3mil) |
| 23 | Min. kaha kiko (mm) | 0.075 (3mil) |
| 24 | ʻO ka mānoanoa o ka huna huna (um) | kihi laina: >8 (0.3mil) ma luna o ke keleawe: >10 (0.4mil) |
| 25 | ENIG mānoanoa gula (um) | 0.025-0.125 |
| 26 | ENIG nickle mānoanoa (um) | 3-9 |
| 27 | Ka mānoanoa kālā Sterling (um) | 0.15-0.75 |
| 28 | Min. mānoanoa HAL tin (um) | 0.75 |
| 29 | ʻO ka mānoanoa o ka ipu kaiapuni (um) | 0.8-1.2 |
| 30 | ʻO ka mānoanoa gula pāpaʻi gula mānoanoa (um) | 1.27-2.0 |
| 31 | manamana lima gula mānoanoa gula (um) | 0.025-1.51 |
| 32 | manamana lima gula mānoanoa nickle (um) | 3-15 |
| 33 | mānoanoa gula pāpaʻi gula (um) | 0,025-0.05 |
| 34 | ka mānoanoa o ka nickle pale gula uila (um) | 3-15 |
| 35 | ka hoʻomanawanui ʻana i ka nui o ka ʻike (mm) | ±0.08 |
| 36 | Max. ka nui o ka puka e hoʻopili ana i ka pale huna (mm) | 0.7 |
| 37 | BGA papa (mm) | ≥0.25 (HAL a i ʻole HAL manuahi:0.35) |
| 38 | V-CUT kūlana hoʻomanawanui (mm) | +/-0.10 |
| 39 | V-CUT kūlana hoʻomanawanui (mm) | +/-0.10 |
| 40 | ʻO ka ʻae ʻana i ke kihi bevel manamana gula (o) | +/-5 |
| 41 | Ka hoʻomanawanui impedence (%) | +/-5% |
| 42 | ʻO ka hoʻomanawanui ʻana o ke kaua (%) | 0.75% |
| 43 | Min. laula moʻolelo (mm) | 0.1 |
| 44 | ʻO ka lapalapa ahi | 94V-0 |
| Kūikawā no Via i nā huahana pad | ʻO ka nui o ka puka i hoʻopili ʻia ke resin (min.) (mm) | 0.3 |
| Ka nui o ka puka i hoʻopaʻa ʻia i ka resin (max.) (mm) | 0.75 | |
| Ka mānoanoa o ka papa i hoʻopili ʻia (min.) (mm) | 0.5 | |
| ʻO ka mānoanoa o ka papa i hoʻopaʻa ʻia i ka resin (max.) (mm) | 3.5 | |
| Hoʻopili ʻia ka lākiō hiʻohiʻona kiʻekiʻe loa | 8:1 | |
| Hoʻopili ʻia ʻo Resin i kahi puka liʻiliʻi loa i kahi puka (mm) | 0.4 | |
| Hiki ke hoʻololi i ka nui o ka puka ma ka papa hoʻokahi? | ʻAe | |
| Papa mokulele hope | 'ikamu | |
| Max. pnl nui (hoʻopau) (mm) | 580*880 | |
| Max. ka nui o ka papa hana (mm) | 914 × 620 | |
| Max. mānoanoa papa (mm) | 12 | |
| Max. papa-luna(L) | 60 | |
| Aspect | 30:1 (Puka min.: 0.4 mm) | |
| Laina laula/wahi (mm) | 0.075/ 0.075 | |
| Hiki ke hoʻoheheʻe hope | ʻAe | |
| ʻO ka ʻae ʻana o ka wili hope (mm) | ±0.05 | |
| ʻO ka ʻae ʻana o nā lua paʻi kūpono (mm) | ±0.05 | |
| ʻAno lapaʻau ʻili | OSP, kala kala, ENIG | |
| Papa ʻoʻoleʻa | Ka nui o ka puka (mm) | 0.2 |
| Mānoanoa dielectrical (mm) | 0.025 | |
| Nui o ka Papa Hana (mm) | 350 x 500 | |
| Laina laula/wahi (mm) | 0.075/ 0.075 | |
| Mea ʻoʻoleʻa | ʻAe | |
| Nā ʻāpana papa hili (L) | 8 (4 pāpaʻi o ka papa lohi) | |
| Nā papa papa ʻoʻoleʻa (L) | ≥14 | |
| Lapaʻau ʻili | ʻO nā mea a pau | |
| ʻO ka papa flex ma waena a i ʻole ka papa waho | ʻelua | |
| Kūikawā no nā huahana HDI | Ka nui o ka lua wili laser (mm) | 0.075 |
| Max. mānoanoa dielectric (mm) | 0.15 | |
| Min. mānoanoa dielectric (mm) | 0.05 | |
| Max. hiʻohiʻona | 1.5:1 | |
| Nui Pad lalo (ma lalo o micro-via) (mm) | Ka nui o ka puka +0.15 | |
| ʻO ka nui Pad ʻaoʻao luna ( ma ka micro-via) (mm) | Ka nui o ka puka +0.15 | |
| Hoʻopiha keleawe a i ʻole (ʻae a ʻaʻole) (mm) | ʻAe | |
| Via i ka hoʻolālā Pad a i ʻole (ʻae a ʻaʻole) | ʻAe | |
| Hoʻopili ʻia ka resin puka kanu ʻia (ʻae a ʻaʻole paha) | ʻAe | |
| Min. ma o ka nui hiki ke hoʻopiha i ke keleawe (mm) | 0.1 | |
| Max. hoʻopaʻa manawa | kekahi papa | |