Izisombululo ze-EMS zeBhodi yeSekethe eShicileleyo
Inkcazo
Ukuxhotyiswa nge-SPI, i-AOI, kunye ne-X-ray ye-20 imigca ye-SMT, i-8 DIP, kunye nemigca yokuvavanya, sinikezela ngenkonzo ephakamileyo equka uluhlu olubanzi lweendlela zokuhlanganisa kunye nokuvelisa i-PCBA ye-multi-layers, i-PCBA eguquguqukayo.Ilabhoratri yethu yobuchwephesha ine-ROHS, ukwehla, i-ESD, kunye nezixhobo zokuvavanya ubushushu obuphezulu & obuphantsi.Zonke iimveliso zihanjiswa ngolawulo olungqongqo lwekhwalithi.Sisebenzisa inkqubo ye-MES ephucukileyo yolawulo lwemveliso phantsi komgangatho we-IAF 16949, siphatha imveliso ngokufanelekileyo nangokukhuselekileyo.
Ngokudibanisa izixhobo kunye neenjineli, sinokunikezela ngezisombululo zeprogram, ukusuka kuphuhliso lwenkqubo ye-IC kunye nesoftware ukuya kuyilo lwesekethe yombane.Ngamava okuphuhlisa iiprojekthi kukhathalelo lwempilo kunye nombane wabathengi, sinokuthatha izimvo zakho kwaye sizise eyona mveliso ebomini.Ngokuphuhlisa isoftware, inkqubo, kunye nebhodi ngokwayo, sinokulawula yonke inkqubo yokwenziwa kwebhodi, kunye neemveliso zokugqibela.Enkosi kumzi-mveliso wethu wePCB kunye neenjineli, isinika iingenelo zokukhuphisana xa kuthelekiswa nomzi-mveliso oqhelekileyo.Ngokusekwe kuyilo lwemveliso kunye neqela lophuhliso, indlela yokuvelisa esekiweyo yobuninzi obahlukeneyo, kunye nonxibelelwano olusebenzayo phakathi kwekhonkco lokubonelela, siqinisekile ngokujongana nemingeni kunye nokwenza umsebenzi wenziwe.
| PCBA Ukubanako | |
| Izixhobo ezizenzekelayo | Inkcazo |
| Laser umatshini wokumakisha PCB500 | Uluhlu lokumakisha: 400 * 400mm |
| Isantya: ≤7000mm/S | |
| Amandla aphezulu: 120W | |
| Ukutshintsha kwe-Q, uMyinge woMsebenzi: 0-25KHZ;0-60% | |
| Umatshini wokushicilela i-DSP-1008 | Ubungakanani bePCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm |
| Ubungakanani bestencil: MAX: 737 * 737mm MIN:420*520mm | |
| Uxinzelelo lwe-scraper: 0.5 ~ 10Kgf / cm2 | |
| Indlela yokucoca: Ukucoca okomileyo, ukucocwa okumanzi, ukucocwa kwevacuum (kuyacwangciswa) | |
| Isantya soshicilelo: 6 ~ 200mm/sec | |
| Ukuchaneka koshicilelo: ± 0.025mm | |
| SPI | Umgaqo wokulinganisa: 3D White Light PSLM PMP |
| Into yokulinganisa: Ivolumu yokuncamathisela ye-Solder, indawo, ukuphakama, i-XY offset, imilo | |
| Isisombululo seLens: 18um | |
| Ukuchaneka: isisombululo se-XY: 1um; Isantya esiphezulu: 0.37um | |
| Jonga ubukhulu: 40 * 40mm | |
| Isantya seFOV: 0.45s/FOV | |
| Isantya esiphezulu somatshini we-SMT SM471 | Ubungakanani bePCB: UMAX:460*250mm MIN:50*40mm T:0.38~4.2mm |
| Inani leeshafu zokuxhoma: I-10 spindles x 2 cantilevers | |
| Ubungakanani becandelo: Chip 0402(01005 intshi) ~ □14mm(H12mm) IC,Isiqhagamshelo(ibala lokukhokela 0.4mm),※BGA,CSP(Isithuba sebhola yeTin 0.4mm) | |
| Ukunyuka ukuchaneka: itshiphu ±50um@3ó/chip, QFP ±30um@3ó/chip | |
| Isantya sokunyuka: 75000 CPH | |
| Isantya esiphezulu somatshini we-SMT SM482 | Ubungakanani bePCB: UMAX:460*400mm MIN:50*40mm T:0.38~4.2mm |
| Inani leeshafu zokuxhoma: I-10 spindles x 1 cantilever | |
| Ubungakanani becandelo: 0402(01005 intshi) ~ □16mm IC,Isiqhagamshelo(ibala lokukhokela 0.4mm),※BGA,CSP(Isithuba sebhola yeTin 0.4mm) | |
| Ukunyuka ukuchaneka: ±50μm@μ+3σ (ngokobungakanani betshiphu eqhelekileyo) | |
| Isantya sokunyuka: 28000 CPH | |
| UHELLER MARK III Isithando somlilo se-nitrogen reflux | Ummandla: Iindawo ezi-9 zokufudumeza, iindawo zokupholisa ezi-2 |
| Umthombo wobushushu: Ukuhambisa umoya oshushu | |
| Ukuchaneka kolawulo lobushushu: ±1℃ | |
| Umthamo wembuyekezo yobushushu: ±2℃ | |
| Isantya se-Orbital: 180-1800mm / min | |
| Uluhlu lobubanzi bengoma: 50—460mm | |
| I-AOI ALD-7727D | Umgaqo wokulinganisa: Ikhamera ye-HD ifumana imbonakalo yecala ngalinye lokukhanya okunemibala emithathu ekhanyayo kwibhodi ye-PCB, kwaye iyigwebe ngokuthelekisa umfanekiso okanye ukusebenza okunengqiqo kwegrey kunye ne-RGB yenqaku ngalinye. |
| Into yokulinganisa: Iziphene zokuprinta ze-Solder, iziphene zamalungu, iziphene ezidibeneyo ze-solder | |
| Isisombululo seLens: 10um | |
| Ukuchaneka: XY isisombululo: ≤8um | |
| I-3D X-RAY AX8200MAX | Ubungakanani obukhulu bokubona: 235mm * 385mm |
| Amandla aphezulu: 8W | |
| Ubuninzi bombane: 90KV/100KV | |
| Ubungakanani bojoliso: 5μm | |
| Ukhuseleko (ithamo lemitha): ＜1uSv/h | |
| Wave soldering DS-250 | PCB ububanzi: 50-250mm |
| PCB transmission ukuphakama: 750 ± 20 mm | |
| Isantya sogqithiso: 0-2000mm | |
| Ubude bendawo yokufudumeza kwangaphambili: 0.8M | |
| Inani lendawo yokufudumeza kwangaphambili: 2 | |
| Inombolo yamaza: Iliza eliphindwe kabini | |
| Umatshini wokuqhawula ibhodi | Uluhlu olusebenzayo: MAX: 285 * 340mm MIN: 50 * 50mm |
| Ukusika ukuchaneka: ± 0.10mm | |
| Isantya sokusika: 0 ~ 100mm/S | |
| Isantya sokujikeleza kwe-spindle: MAX: 40000rpm | |
| UbuGcisa beTekhnoloji | ||
| Inani | Into | Isakhono esikhulu |
| 1 | imathiriyeli esisiseko | I-Tg ye-FR4 eqhelekileyo, i-Tg ephakamileyo ye-FR4, i-PTFE, i-Rogers, i-Low Dk / Df njl njl. |
| 2 | Umbala wemaski yeSolder | eluhlaza, ebomvu, eluhlaza okwesibhakabhaka, emhlophe, emthubi, emfusa, emnyama |
| 3 | Umbala wentsomi | mhlophe, tyheli, mnyama, bomvu |
| 4 | Uhlobo lonyango lomphezulu | ENIG, itoti yokuntywiliselwa, HAF, HAF LF, OSP, igolide ekhanyayo, umnwe wegolide, isilivere eqaqambileyo |
| 5 | Max.umaleko-phezulu(L) | 50 |
| 6 | Max.ubungakanani beyunithi (mm) | 620*813 (24"*32") |
| 7 | Max.ubungakanani bephaneli yokusebenza (mm) | 620*900 (24"x35.4") |
| 8 | Max.ubukhulu bebhodi (mm) | 12 |
| 9 | Min.ubukhulu bebhodi(mm) | 0.3 |
| 10 | Ukunyamezela ukutyeba kwebhodi (mm) | T<1.0 mm: +/-0.10mm ;T≥1.00mm: +/-10% |
| 11 | Ukunyamezela ubhaliso (mm) | +/-0.10 |
| 12 | Min.Umngxuma wokomba oomatshini ubukhulu becala (mm) | 0.15 |
| 13 | Min.laser yokomba umngxuma ububanzi (mm) | 0.075 |
| 14 | Max.imbonakalo (umngxuma) | 15:1 |
| Max.inkalo (micro-via) | 1.3:1 | |
| 15 | Min.emngxunyeni kwisithuba sobhedu(mm) | L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25；L＞44, 0.3 |
| 16 | Min.ucoceko lwangaphakathi (mm) | 0.15 |
| 17 | Min.emngxunyeni emngxunyeni indawo (mm) | 0.28 |
| 18 | Min.udini lomngxuma kwisithuba somgca weprofayile(mm) | 0.2 |
| 19 | Min.ubhedu lwangaphakathi ukuya kumgca weprofayile (mm) | 0.2 |
| 20 | Ukunyamezela ubhaliso phakathi kwemingxunya (mm) | ±0.05 |
| 21 | Max.Ubunzima bobhedu obugqityiweyo (um) | Umaleko wangaphandle: 420 (12oz) Uluhlu lwangaphakathi: 210 (6oz) |
| 22 | Min.umkhondo ububanzi (mm) | 0.075 (3mil) |
| 23 | Min.indawo yokukhangela (mm) | 0.075 (3mil) |
| 24 | Ubukhulu bemaski yesoda (um) | ikona yomgca: >8 (0.3mil) phezu kobhedu: >10 (0.4mil) |
| 25 | ENIG ubukhulu begolide (um) | 0.025-0.125 |
| 26 | Ubukhulu benickle ye-ENIG (um) | 3-9 |
| 27 | Ubunzima besilivere yeSterling (um) | 0.15-0.75 |
| 28 | Min.HAL ubukhulu betoti (um) | 0.75 |
| 29 | Ukuntywiliselwa ubunzima betoti (um) | 0.8-1.2 |
| 30 | Ubungqingqwa begolide etyatyekwe ngegolide (um) | 1.27-2.0 |
| 31 | umnwe wegolide watyabeka ubukhulu begolide (um) | 0.025-1.51 |
| 32 | umnwe wegolide utyabeka ubukhulu benickle(um) | 3-15 |
| 33 | Ubungqingqwa begolide ehonjiswe ngegolide (um) | 0,025-0.05 |
| 34 | Ubunzima benickle yegolide edanyazayo (um) | 3-15 |
| 35 | Ukunyamezela ubungakanani beprofayile (mm) | ±0.08 |
| 36 | Max.Imaski yesolder yokuplaga ubungakanani bomngxuma (mm) | 0.7 |
| 37 | Iphedi ye-BGA (mm) | ≥0.25 (HAL okanye HAL Mahala:0.35) |
| 38 | V-CUT ukunyamezela indawo yeblade (mm) | +/-0.10 |
| 39 | Unyamezelo lwendawo ye-V-CUT (mm) | +/-0.10 |
| 40 | Ukunyamezela i-engile yomnwe wegolide (o) | +/-5 |
| 41 | Ukunyamezela ukunyamezela (%) | +/-5% |
| 42 | Ukunyamezela iWarpage (%) | 0.75% |
| 43 | Min.Ububanzi belegend (mm) | 0.1 |
| 44 | Idangatye lomlilo liyaphola | 94V-0 |
| Ezikhethekileyo Via kwiimveliso pad | Ubungakanani bomngxuma wentlantsi eplagwe (min.) (mm) | 0.3 |
| Ubungakanani bomngxuma weresin eplagiweyo (ubuninzi.) (mm) | 0.75 | |
| Ubukhulu bebhodi eplagiwe intlaka (min.) (mm) | 0.5 | |
| Ubukhulu bebhodi eplagiwe intlaka (ubuninzi.) (mm) | 3.5 | |
| I-resin iplagwe umlinganiselo we-aspect ratio | 8:1 | |
| Intlaka eplage ubuncinane umngxuma kwisithuba somngxuma (mm) | 0.4 | |
| Ngaba umahluko ubungakanani bomngxuma kwibhodi enye? | Ewe | |
| Ibhodi yendiza yangasemva | Into | |
| Max.ubungakanani bepnl (bugqityiwe) (mm) | 580*880 | |
| Max.ubungakanani bephaneli yokusebenza (mm) | 914 × 620 | |
| Max.ubukhulu bebhodi (mm) | 12 | |
| Max.umaleko-phezulu(L) | 60 | |
| Umba | 30:1 (Umngxuma omncinci: 0.4 mm) | |
| Ububanzi bomgca/isithuba (mm) | 0.075/ 0.075 | |
| Ikhono lokubhola ngasemva | Ewe | |
| Ukunyamezela ukubhola ngasemva (mm) | ±0.05 | |
| Ukunyamezela imingxunya yokucinezela (mm) | ±0.05 | |
| Uhlobo lonyango lomphezulu | OSP, isilivere eqaqambileyo, ENIG | |
| Ibhodi eqinile-flex | Ubungakanani bomngxuma (mm) | 0.2 |
| Ubunzima bombane (mm) | 0.025 | |
| Ubungakanani bePaneli yoMsebenzi (mm) | 350 x 500 | |
| Ububanzi bomgca/isithuba (mm) | 0.075/ 0.075 | |
| Stiffener | Ewe | |
| Ileya zebhodi yeFleksi (L) | 8 (4 iiplys of flex board) | |
| Izaleko zebhodi eziqinileyo (L) | ≥14 | |
| Unyango lomphezulu | Konke | |
| Ibhodi Flex phakathi okanye ngaphandle umaleko | Zombini | |
| Ezikhethekileyo kwiimveliso ze-HDI | Ubungakanani bomngxunya weLaser (mm) | 0.075 |
| Max.ubukhulu bedielectric (mm) | 0.15 | |
| Min.ubukhulu bedielectric (mm) | 0.05 | |
| Max.inkalo | 1.5:1 | |
| Ubungakanani bePad esezantsi (phantsi kwemicro-via) (mm) | Ubungakanani bomngxuma +0,15 | |
| Kwicala eliphezulu ubungakanani bePad ( kwimicro-via) (mm) | Ubungakanani bomngxuma +0,15 | |
| Ukuzaliswa kobhedu okanye hayi (ewe okanye hayi) (mm) | Ewe | |
| Ngokuhamba kuyilo lwePad okanye hayi (ewe okanye hayi) | Ewe | |
| I-resin yomngxuma ogxunyekiweyo iplakiwe (ewe okanye hayi) | Ewe | |
| Min.ngobungakanani kunokuzaliswa ubhedu (mm) | 0.1 | |
| Max.amaxesha emfumba | nawuphi na umaleko | |