uhlelo lokusebenza_21

Izixazululo ze-EMS zeBhodi Lesifunda Eliphrintiwe

Uzakwethu we-EMS wephrojekthi ye-JDM, OEM, ne-ODM.

Izixazululo ze-EMS zeBhodi Lesifunda Eliphrintiwe

Njengozakwethu wesevisi yokukhiqiza ugesi (EMS), i-Minewing ihlinzeka ngezinsizakalo ze-JDM, i-OEM, ne-ODM kumakhasimende omhlaba wonke ukuze akhiqize ibhodi, njengebhodi elisetshenziswa ezindlini ezihlakaniphile, izilawuli zezimboni, izinto ezigqokekayo, amabhakhoni, nezinto zikagesi zamakhasimende.Sithenga zonke izingxenye ze-BOM kumenzeli wokuqala wefekthri, njengekusasa, umcibisholo, i-Espressif, i-Antenova, i-Wasun, i-ICKey, i-Digikey, i-Qucetel, ne-U-blox, ukuze sigcine ikhwalithi.Singakusekela esigabeni sokuklama nokuthuthuka ukuze sikunikeze iseluleko sezobuchwepheshe ngenqubo yokukhiqiza, ukwenziwa ngcono komkhiqizo, ama-prototypes asheshayo, ukuthuthukiswa kokuhlola, nokukhiqizwa ngobuningi.Siyazi ukuthi angakha kanjani ama-PCB ngenqubo yokukhiqiza efanele.


Imininingwane Yesevisi

Omaka Besevisi

Incazelo

Ifakwe i-SPI, i-AOI, kanye nedivayisi ye-X-ray yemigqa engu-20 ye-SMT, 8 DIP, nemigqa yokuhlola, sinikeza isevisi ethuthukisiwe ehlanganisa amasu amaningi okuhlanganisa futhi sikhiqize i-PCBA enezendlalelo eziningi, i-PCBA eguquguqukayo.Ilabhorethri yethu yobungcweti ine-ROHS, eyehlayo, i-ESD, namadivayisi okuhlola izinga lokushisa eliphezulu neliphansi.Yonke imikhiqizo idluliswa ngokulawulwa kwekhwalithi okuqinile.Sisebenzisa uhlelo oluthuthukisiwe lwe-MES lokuphathwa kokukhiqiza ngaphansi kwezinga le-IAF 16949, siphatha ukukhiqiza ngempumelelo nangokuphepha.
Ngokuhlanganisa izinsiza kanye nonjiniyela, singaphinda sinikeze izixazululo zohlelo, kusukela ekuthuthukisweni kohlelo lwe-IC kanye nesofthiwe kuya ekwakhiweni kwesekethe kagesi.Ngesipiliyoni sokuthuthukisa amaphrojekthi kwezokunakekelwa kwezempilo kanye ne-electronics yamakhasimende, singathatha imibono yakho futhi senze umkhiqizo wangempela uphile.Ngokuthuthukisa isofthiwe, uhlelo, kanye nebhodi ngokwalo, singaphatha yonke inqubo yokukhiqiza yebhodi, kanye nemikhiqizo yokugcina.Ngenxa yefekthri yethu ye-PCB kanye nonjiniyela, isinikeza izinzuzo zokuncintisana uma kuqhathaniswa nemboni evamile.Ngokusekelwe ekuklanyweni komkhiqizo nethimba lokuthuthukisa, indlela yokukhiqiza emisiwe yamanani ahlukene, nokuxhumana okuphumelelayo phakathi kochungechunge lokuhlinzeka, siyaqiniseka ukuthi sizobhekana nezinselele futhi senze umsebenzi wenziwe.

PCBA Amandla

Imishini ezenzakalelayo

Incazelo

Umshini wokumaka we-laser PCB500

Ibanga lokumaka: 400 * 400mm
Isivinini: ≤7000mm/S
Amandla aphezulu: 120W
Ukushintsha i-Q, Isilinganiso somsebenzi: 0-25KHZ;0-60%

Umshini wokunyathelisa i-DSP-1008

Usayizi we-PCB: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm
Usayizi westencil: MAX: 737 * 737mm
MIN:420*520mm
Ingcindezi ye-Scraper: 0.5 ~ 10Kgf/cm2
Indlela yokuhlanza: Ukuhlanza okomile, ukuhlanza okumanzi, ukuhlanza i-vacuum (kuyahleleka)
Isivinini sokuphrinta: 6 ~ 200mm/sec
Ukunemba kokuphrinta: ±0.025mm

I-SPI

Umgomo wokulinganisa: 3D White Light PSLM PMP
Into yokulinganisa: Ivolumu yokunamathisela ye-Solder, indawo, ukuphakama, i-XY offset, umumo
Ukulungiswa kwelensi: 18um
Ukunemba: ukulungiswa kwe-XY: 1um;
Isivinini esiphezulu: 0.37um
Buka ubukhulu: 40*40mm
Isivinini se-FOV: 0.45s/FOV

Isivinini esiphezulu se-SMT umshini SM471

Usayizi we-PCB: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm
Inani lamashafu afakwayo: 10 ama-spindle x 2 cantilever
Usayizi wengxenye: I-Chip 0402(01005 intshi) ~ □14mm(H12mm) IC,Isixhumi(iphimbo lokuhola 0.4mm),※BGA,CSP(Isikhala sebhola likathini 0.4mm)
Ukunemba kokukhweza: chip ±50um@3ó/chip, QFP ±30um@3ó/chip
Isivinini sokukhweza: 75000 CPH

Isivinini esiphezulu se-SMT umshini SM482

Usayizi we-PCB: UMAX:460*400mm MIN:50*40mm T:0.38~4.2mm
Inani lamashafti afakwayo: 10 ama-spindles x 1 cantilever
Usayizi wengxenye: 0402(01005 iyintshi) ~ □16mm IC,Isixhumi(i-lead pitch 0.4mm),※BGA,CSP(Isikhala sebhola likathini 0.4mm)
Ukunemba kokukhweza: ±50μm@μ+3σ (ngokuya ngosayizi we-chip ojwayelekile)
Isivinini sokukhweza: 28000 CPH

U-HELLER MARK III Isithando somlilo se-nitrogen reflux

Indawo: 9 izindawo zokushisa, izindawo zokupholisa ezi-2
Umthombo wokushisa: Iconvection yomoya oshisayo
Ukunemba kokulawula izinga lokushisa: ±1℃
Umthamo wesinxephezelo esishisayo: ±2℃
Isivinini se-Orbital: 180—1800mm/min
Ibanga lobubanzi bethrekhi: 50—460mm

I-AOI ALD-7727D

Umgomo wokulinganisa: Ikhamera ye-HD ithola isimo sokuboniswa kwengxenye ngayinye yokukhanya okunemibala emithathu ekhipha imisebe ebhodini le-PCB, futhi iyahlulela ngokufanisa isithombe noma ukusebenza okunengqondo kwamanani ampunga nawe-RGB wephoyinti ngalinye lephikseli.
Into yokulinganisa: Ukukhubazeka kokuphrinta kwe-Solder, izingxenye ezingalungile, ukukhubazeka okuhlangene kwe-solder
Ukulungiswa kwelensi: 10um
Ukunemba: ukulungiswa kwe-XY: ≤8um

I-3D X-RAY AX8200MAX

Ubukhulu bosayizi wokutholwa: 235mm*385mm
Amandla aphezulu: 8W
Amandla kagesi aphezulu: 90KV/100KV
Usayizi wokugxila: 5μm
Ukuphepha (umthamo womsebe): <1uSv/h

I-Wave soldering DS-250

Ububanzi be-PCB: 50-250mm
Ubude bokudluliselwa kwe-PCB: 750 ± 20 mm
Isivinini sokudlulisa: 0-2000mm
Ubude bendawo yokushisa ngaphambili: 0.8M
Inombolo yendawo yokushisisa kwangaphambili: 2
Inombolo yegagasi: Igagasi elikabili

Umshini wokuhlukanisa ibhodi

Ibanga lokusebenza: MAX:285*340mm MIN:50*50mm
Ukusika ukunemba: ± 0.10mm
Isivinini sokusika: 0 ~ 100mm/S
Isivinini sokujikeleza kwe-spindle: MAX: 40000rpm

Ikhono Lobuchwepheshe

Inombolo

Into

Amandla amakhulu

1

impahla eyisisekelo I-Tg FR4 evamile, i-High Tg FR4, i-PTFE, i-Rogers, i-Dk/Df ephansi njll.

2

Umbala wemaski we-Solder oluhlaza, obomvu, oluhlaza okwesibhakabhaka, omhlophe, ophuzi, onsomi, omnyama

3

Umbala welejendi omhlophe, ophuzi, omnyama, obomvu

4

Uhlobo lokwelapha olungaphezulu I-ENIG, I-Immersion tin, HAF, HAF LF, OSP, igolide elikhanyayo, umunwe wegolide, isiliva esicwebezelayo

5

Ubukhulu.ungqimba (L) 50

6

Ubukhulu.usayizi weyunithi (mm) 620*813 (24"*32")

7

Ubukhulu.usayizi wephaneli yokusebenza (mm) 620*900 (24"x35.4")

8

Ubukhulu.ubukhulu bebhodi (mm) 12

9

Okuncane.ubukhulu bebhodi(mm) 0.3

10

Ukubekezelela ubukhulu bebhodi (mm) T<1.0 mm: +/-0.10mm ;T≥1.00mm: +/-10%

11

Ukubekezelela ukubhalisa (mm) +/-0.10

12

Okuncane.Ububanzi bembobo yokumba ngomshini (mm) 0.15

13

Okuncane.I-laser drilling hole ububanzi(mm) 0.075

14

Ubukhulu.isici (ngembobo) 15:1
Ubukhulu.isici (micro-via) 1.3:1

15

Okuncane.unqenqema lwembobo endaweni yethusi(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3

16

Okuncane.imvume ye-innerlay(mm) 0.15

17

Okuncane.unqenqema lwembobo ukuya endaweni enqenqemeni yembobo(mm) 0.28

18

Okuncane.unqenqema lwembobo endaweni yomugqa wephrofayela(mm) 0.2

19

Okuncane.ithusi le-innerlay kumugqa wephrofayili (mm) 0.2

20

Ukubekezelela ukubhalisa phakathi kwezimbobo (mm) ±0.05

21

Ubukhulu.ugqinsi lwethusi oluqediwe (um) Isendlalelo Sangaphandle: 420 (12oz)
Isendlalelo sangaphakathi: 210 (6oz)

22

Okuncane.trace ububanzi (mm) 0.075 (3mil)

23

Okuncane.indawo yokulandelela (mm) 0.075 (3mil)

24

Ubukhulu bemaski ye-solder (um) Ikhona lomugqa: >8 (0.3mil)
phezu kwethusi: >10 (0.4mil)

25

Ugqinsi lwegolide lwe-ENIG (um) 0.025-0.125

26

Ubukhulu be-nickle ye-ENIG (um) 3-9

27

Ugqinsi lwesiliva lwe-Sterling (um) 0.15-0,75

28

Okuncane.I-HAL tin ukujiya (um) 0.75

29

Ubukhulu bethini lokucwiliswa (um) 0.8-1.2

30

Ugqinsi lwegolide olugqize ngegolide (um) 1.27-2.0

31

ugqinsi lwegolide lomunwe wegolide (um) 0.025-1.51

32

ugqinsi lwe-nickle lomunwe wegolide (um) 3-15

33

ugqinsi lwegolide olucwebezelayo (um) 0,025-0.05

34

ugqinsi lwe-nickle yegolide ecwebezelayo (um) 3-15

35

ukubekezelela usayizi wephrofayela (mm) ±0.08

36

Ubukhulu.imaski yokuxhuma usayizi wembobo (mm) 0.7

37

Iphedi ye-BGA (mm) ≥0.25 (HAL noma i-HAL Mahhala:0.35)

38

Ukubekezelela indawo ye-V-CUT blade (mm) +/-0.10

39

Ukubekezelela isikhundla se-V-CUT (mm) +/-0.10

40

Ukubekezelela i-engeli ye-golden bevel (o) +/-5

41

Ukubekezelela impedence (%) +/-5%

42

Ukubekezelela i-Warpage (%) 0.75%

43

Okuncane.ububanzi be-legend (mm) 0.1

44

Ilangabi lomlilo liyaphola 94V-0

Okukhethekile kwe-Via emikhiqizweni yephedi

Usayizi wembobo exhunyiwe ye-resin (min.) (mm) 0.3
Usayizi wembobo exhunyiwe ye-resin (ubukhulu) (mm) 0.75
Ukujiya kwebhodi elixhunyiwe nge-resin (min.) (mm) 0.5
Ubukhulu bebhodi elixhunyiwe nge-resin (ubukhulu) (mm) 3.5
I-resin exhunyiwe ye-aspect ratio ephezulu 8:1
I-resin ixhume imbobo encane esikhaleni sembobo (mm) 0.4
Ingabe ungahlukanisa usayizi wembobo ebhodini elilodwa? yebo

Ibhodi lendiza elingemuva

Into
Ubukhulu.usayizi we-pnl (uqediwe) (mm) 580*880
Ubukhulu.usayizi wephaneli yokusebenza (mm) 914 × 620
Ubukhulu.ubukhulu bebhodi (mm) 12
Ubukhulu.ungqimba (L) 60
Isici 30:1 (Imbobo encane: 0.4 mm)
Ububanzi bomugqa/isikhala (mm) 0.075/ 0.075
Ikhono lokubhola emuva Yebo
Ukubekezelela ukubhola emuva (mm) ±0.05
Ukubekezelela izimbobo zokucindezela (mm) ±0.05
Uhlobo lokwelapha olungaphezulu I-OSP, isiliva esicwebezelayo, i-ENIG

Ibhodi le-Rigid-flex

Usayizi wembobo (mm) 0.2
Ubukhulu be-Dielectrical (mm) 0.025
Usayizi Wephaneli Esebenzayo (mm) 350 x 500
Ububanzi bomugqa/isikhala (mm) 0.075/ 0.075
I-Stiffener Yebo
Izendlalelo zebhodi le-Flex (L) 8 (amapulangwe ama-4 ebhodi eliguqukayo)
Izendlalelo zebhodi eziqinile (L) ≥14
Ukwelashwa kwendawo Konke
Ibhodi le-Flex phakathi noma ungqimba lwangaphandle Kokubili

Okukhethekile kwemikhiqizo ye-HDI

Usayizi wembobo yokumba i-laser (mm)

0.075

Ubukhulu.ubukhulu be-dielectric (mm)

0.15

Okuncane.ubukhulu be-dielectric (mm)

0.05

Ubukhulu.isici

1.5:1

Usayizi Wephedi Eliphansi (ngaphansi kwe-micro-via) (mm)

Usayizi wembobo+0.15

Usayizi wephedi ohlangothini olungaphezulu ( ku-micro-via) (mm)

Usayizi wembobo+0.15

Ukugcwaliswa kwethusi noma cha (yebo noma cha) (mm)

yebo

Nge-Pad design noma cha (yebo noma cha)

yebo

I-resin yembobo engcwatshiwe ixhunyiwe (yebo noma cha)

yebo

Okuncane.ngosayizi ingagcwaliswa ithusi (mm)

0.1

Ubukhulu.izikhathi zesitaki

noma yisiphi isendlalelo

  • Okwedlule:
  • Olandelayo: