EMS kev daws teeb meem rau Printed Circuit Board
Kev piav qhia
Nruab nrog SPI, AOI, thiab X-ray ntaus ntawv rau 20 SMT kab, 8 DIP, thiab cov kab xeem, peb muab cov kev pabcuam siab heev uas suav nrog ntau hom kev sib dhos thiab tsim cov txheej txheem ntau PCBA, hloov pauv PCBA.Peb lub chaw soj nstuam tshaj lij muaj ROHS, poob, ESD, thiab ntsuas kub & qis.Tag nrho cov khoom raug xa los ntawm kev tswj xyuas nruj.Siv cov txheej txheem MES siab heev rau kev tswj hwm kev tsim khoom raws li IAF 16949 tus qauv, peb tswj cov khoom tsim tau zoo thiab ruaj ntseg.
Los ntawm kev sib txuas cov peev txheej thiab cov engineers, peb kuj tuaj yeem muab cov kev daws teeb meem, los ntawm IC kev tsim kho thiab software rau hluav taws xob tsim hluav taws xob.Nrog kev paub dhau los hauv kev tsim cov haujlwm hauv kev kho mob thiab cov neeg siv khoom siv hluav taws xob, peb tuaj yeem tswj koj lub tswv yim thiab coj cov khoom tiag tiag rau lub neej.Los ntawm kev tsim cov software, kev pab cuam, thiab lub rooj tsavxwm nws tus kheej, peb tuaj yeem tswj hwm tag nrho cov txheej txheem tsim khoom rau lub rooj tsavxwm, nrog rau cov khoom kawg.Ua tsaug rau peb lub Hoobkas PCB thiab cov engineers, nws muab peb cov kev sib tw zoo piv rau lub Hoobkas zoo tib yam.Raws li cov khoom tsim & kev txhim kho pab pawg, tsim qauv tsim ntawm ntau qhov sib txawv, thiab kev sib txuas lus zoo ntawm cov saw hlau, peb muaj kev ntseeg siab ntawm kev sib tw thiab ua tiav cov haujlwm.
| PCBA Muaj peev xwm | |
| Cov khoom siv tsis siv neeg | Kev piav qhia |
| Laser npav tshuab PCB500 | Marking ntau: 400 * 400mm |
| Ceev: ≤7000mm / S | |
| Lub zog siab tshaj plaws: 120W | |
| Q-hloov, Lub luag haujlwm piv: 0-25KHZ;0-60% | |
| Lub tshuab luam ntawv DSP-1008 | PCB loj: MAX: 400 * 34mm MIN: 50 * 50mm T: 0.2 ~ 6.0mm |
| Stencil loj: MAX: 737 * 737mm Loj: 420 * 520mm | |
| Scraper siab: 0.5 ~ 10Kgf / cm2 | |
| Txoj kev ntxuav: qhuav tu, ntub tu, nqus tsev vacuum (programmable) | |
| Printing ceev: 6 ~ 200mm / sec | |
| Printing qhov tseeb: ± 0.025mm | |
| SPI | Kev ntsuas txoj cai: 3D Dawb Lub Teeb PSLM PMP |
| Cov khoom ntsuas: Solder paste ntim, cheeb tsam, qhov siab, XY offset, duab | |
| Lens daws teeb meem: 18um | |
| Precision: XY daws teeb meem: 1um; Kev kub ceev: 0.37um | |
| Saib qhov loj: 40 * 40mm | |
| FOV ceev: 0.45s / FOV | |
| Kev kub ceev SMT tshuab SM471 | PCB loj: MAX: 460 * 250mm MIN: 50 * 40mm T: 0.38 ~ 4.2mm |
| Number of mounting shafts: 10 spindles x 2 cantilevers | |
| Cov khoom loj: Chip 0402 (01005 inch) ~ □ 14mm (H12mm) IC, Connector (lead pitch 0.4mm), ※ BGA, CSP (Tin pob sib nrug 0.4mm) | |
| Mounting raug: nti ± 50um @ 3ó / nti, QFP ± 30um @ 3ó / nti | |
| Mounting ceev: 75000 CPH | |
| Kev kub ceev SMT tshuab SM482 | PCB loj: MAX: 460 * 400mm MIN: 50 * 40mm T: 0.38 ~ 4.2mm |
| Number of mounting shafts: 10 spindles x 1 cantilever | |
| Cov khoom loj: 0402 (01005 nti) ~ □ 16mm IC, Txuas (cov hlau lead suab 0.4mm), ※ BGA, CSP (Tin pob sib nrug 0.4mm) | |
| Mounting raug: ± 50μm @ μ + 3σ (raws li tus qauv nti loj) | |
| Mounting ceev: 28000 CPH | |
| HELLER MARK III Nitrogen reflux rauv | Thaj Chaw: 9 thaj chaw cua sov, 2 thaj chaw txias |
| Thaum tshav kub kub qhov chaw: cua kub convection | |
| Kev tswj qhov kub thiab txias: ± 1 ℃ | |
| Thermal them nyiaj muaj peev xwm: ± 2 ℃ | |
| Orbital ceev: 180-1800mm / min | |
| Txoj kab uas hla dav: 50-460mm | |
| AOI ALD-7727D | Kev ntsuas lub hauv paus ntsiab lus: Lub koob yees duab HD tau txais qhov kev xav ntawm lub xeev ntawm txhua qhov ntawm peb-xim lub teeb irradiating ntawm PCB pawg thawj coj saib, thiab txiav txim nws los ntawm kev sib piv cov duab lossis cov laj thawj ua haujlwm ntawm grey thiab RGB qhov tseem ceeb ntawm txhua pixel point. |
| Cov khoom ntsuas: Solder paste printing defects, qhov chaw tsis xws luag, solder joint defects | |
| Lens daws teeb meem: 10um | |
| Precision: XY daws teeb meem: ≤8um | |
| 3D X-RAY AX8200MAX | Qhov siab tshaj plaws nrhiav tau qhov loj me: 235mm * 385mm |
| Lub zog siab tshaj plaws: 8W | |
| Qhov siab tshaj plaws voltage: 90KV / 100KV | |
| Focus loj: 5μm | |
| Kev nyab xeeb (duab hluav taws xob): ＜1uSv/h | |
| Wave soldering DS-250 | PCB dav: 50-250mm |
| PCB kis tau tus mob qhov siab: 750 ± 20 mm | |
| Kev sib kis ceev: 0-2000mm | |
| Ntev ntawm preheating cheeb tsam: 0.8M | |
| Tus naj npawb ntawm preheating cheeb tsam: 2 | |
| Wave naj npawb: dual wave | |
| Board splitter tshuab | Ua haujlwm ntau: MAX: 285 * 340mm MIN: 50 * 50mm |
| Txiav precision: ± 0.10mm | |
| Txiav ceev: 0 ~ 100mm / S | |
| Kev sib hloov ceev ntawm spindle: MAX: 40000rpm | |
| Tshuab muaj peev xwm | ||
| Tus lej | Yam khoom | Muaj peev xwm loj |
| 1 | cov ntaub ntawv hauv paus | Ib txwm Tg FR4, High Tg FR4, PTFE, Rogers, Tsawg Dk / Df thiab lwm yam. |
| 2 | Solder mask xim | ntsuab, liab, xiav, dawb, daj, ntshav, dub |
| 3 | Lus dab neeg xim | dawb, daj, dub, liab |
| 4 | Hom kev kho deg | ENIG, Immersion tin, HAF, HAF LF, OSP, flash kub, kub ntiv tes, sterling nyiaj |
| 5 | Max.txheej txheej (L) | 50 |
| 6 | Max.unit loj (mm) | 620 * 813 (24 "* 32") loj |
| 7 | Max.Ua haujlwm vaj huam sib luag loj (mm) | 620 * 900 hli (24 "x 35.4") |
| 8 | Max.Board thickness (mm) | 12 |
| 9 | Min.Board thickness (mm) | 0.3 |
| 10 | Board thickness kam rau ua (mm) | T <1.0 hli: +/- 0.10mm;T≥1.00mm: +/- 10% |
| 11 | Registration kam rau ua (mm) | +/- 0.10 |
| 12 | Min.mechanical drilling qhov taub (mm) | 0.15 |
| 13 | Min.laser drilling qhov taub (mm) | 0.075 ib |
| 14 | Max.nam (los ntawm qhov) | 15:1 |
| Max.nam (micro-via) | 1.3: 1 | |
| 15 | Min.qhov ntug rau tooj liab qhov chaw (mm) | L≤10, 0.15；L = 12-22,0.175；L = 24-34, 0.2；L = 36-44, 0.25＞44, 0.3 |
| 16 | Min.sab hauv clearance (mm) | 0.15 |
| 17 | Min.qhov ntug rau qhov ntug qhov chaw (mm) | 0.28 ib |
| 18 | Min.qhov ntug rau profile kab qhov chaw (mm) | 0.2 |
| 19 | Min.innerlay tooj liab rau profile kab sapce (mm) | 0.2 |
| 20 | Kev tso npe kam rau nruab nrab ntawm qhov (mm) | ± 0.05 hli |
| 21 | Max.tiav tooj liab thickness (um) | Txheej txheej: 420 (12oz) Sab hauv txheej: 210 (6oz) |
| 22 | Min.kab dav dav (mm) | 0.075 (3mil) |
| 23 | Min.Qhov chaw seem (mm) | 0.075 (3mil) |
| 24 | Solder mask thickness (um) | Kab kaum:> 8 (0.3mil) Raws li tooj liab:> 10 (0.4mil) |
| 25 | ENIG golden thickness (um) | 0.025-0.125 hli |
| 26 | ENIG nickle thickness (um) | 3-9 |
| 27 | Sterling nyiaj thickness (um) | 0.15-0.75 Nws |
| 28 | Min.HAL tin thickness (um) | 0.75 ib |
| 29 | Immersion tin thickness (um) | 0.8-1.2 hli |
| 30 | Hard-thick kub plating kub thickness (um) | 1.27-2.0 Nws |
| 31 | golden ntiv tes plating kub thickness (um) | 0.025-1.51 Nws |
| 32 | golden ntiv tes plating nickle thickness (um) | 3-15 |
| 33 | flash kub plating kub thickness (um) | 0,025-0.05 Nws |
| 34 | flash kub plating nickle thickness (um) | 3-15 |
| 35 | profile loj kam rau ua (mm) | ± 0.08 hli |
| 36 | Max.solder daim npog qhov ncauj qhov loj (mm) | 0.7 ua |
| 37 | BGA ncoo (mm) | ≥0.25 (HAL lossis HAL Dawb: 0.35) |
| 38 | V-CUT hniav txoj hauj lwm kam rau ua (mm) | +/- 0.10 |
| 39 | V-CUT txoj hauj lwm kam rau ua (mm) | +/- 0.10 |
| 40 | Kub ntiv tes bevel kaum sab xis (o) | +/-5 |
| 41 | Impedence kam rau ua (%) | +/- 5% |
| 42 | Warpage kam rau ua (%) | 0.75% |
| 43 | Min.lus dav dav (mm) | 0.1 |
| 44 | Hluav taws kub calss | 94v 0 |
| Tshwj xeeb rau Via hauv cov khoom pad | Resin plugged qhov loj (min.) (mm) | 0.3 |
| Resin plugged qhov loj (max.) (mm) | 0.75 ib | |
| Resin plugged board thickness (min.) (mm) | 0.5 | |
| Resin plugged board thickness (max.) (mm) | 3.5 | |
| Resin ntsaws qhov siab tshaj plaws nam piv | 8:1 ua | |
| Resin ntsaws qhov tsawg kawg nkaus rau qhov chaw qhov (mm) | 0.4 | |
| Yuav txawv qhov luaj li cas hauv ib lub rooj tsavxwm? | yog | |
| Rov qab dav hlau board | Yam khoom | |
| Max.pnl loj (tiav) (mm) | 580 * 880 hli | |
| Max.Ua haujlwm vaj huam sib luag loj (mm) | 914 × 620 | |
| Max.Board thickness (mm) | 12 | |
| Max.txheej txheej (L) | 60 | |
| Yam | 30: 1 (Min. qhov: 0.4mm) | |
| Kab dav / qhov chaw (mm) | 0.075 / 0.075 hli | |
| Back laum muaj peev xwm | Yog lawm | |
| Tolerance ntawm rov qab laum (mm) | ± 0.05 hli | |
| Tolerance ntawm xovxwm haum qhov (mm) | ± 0.05 hli | |
| Hom kev kho deg | OSP, sterling silver, ENIG | |
| Rigid-flex board | Qhov loj (mm) | 0.2 |
| Dielectric thickness (hli) | 0.025 ib | |
| Vaj Huam Sib Luag Loj (mm) | 350 x 500 | |
| Kab dav / qhov chaw (mm) | 0.075 / 0.075 hli | |
| Stiffener | Yog lawm | |
| Flex board txheej (L) | 8 (4 plys ntawm flex board) | |
| Rigid board txheej (L) | ≥14 | |
| Kev kho saum npoo | Tag nrho | |
| Flex board nyob nruab nrab lossis txheej txheej | Ob leeg | |
| Tshwj xeeb rau cov khoom HDI | Laser drilling qhov loj (mm) | 0.075 ib |
| Max.dielectric thickness (hli) | 0.15 | |
| Min.dielectric thickness (hli) | 0.05 Nws | |
| Max.yam | 1.5: 1 | |
| Hauv qab Pad loj (hauv qab micro-via) (mm) | Qhov loj me + 0.15 | |
| Sab saum toj Pad loj (ntawm micro-via) (mm) | Qhov loj me + 0.15 | |
| Copper filling lossis tsis (yog lossis tsis yog) (mm) | yog | |
| Los ntawm hauv Pad tsim lossis tsis (yog lossis tsis yog) | yog | |
| buried qhov resin ntsaws (yog los yog tsis) | yog | |
| Min.ntawm qhov loj tuaj yeem ua tau tooj liab puv (mm) | 0.1 | |
| Max.pawg sijhawm | tej txheej | |