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EMS tharollo bakeng sa Printed Circuit Board

Molekane oa hau oa EMS bakeng sa merero ea JDM, OEM, le ODM.

EMS tharollo bakeng sa Printed Circuit Board

E le molekane oa ts'ebeletso ea tlhahiso ea lisebelisoa tsa elektronike (EMS), Minewing e fana ka litšebeletso tsa JDM, OEM, le ODM bakeng sa bareki ba lefats'e ka bophara ho hlahisa boto, joalo ka boto e sebelisoang malapeng a bohlale, taolo ea indasteri, lisebelisoa tse aparoang, li-beacon le lisebelisoa tsa elektronike tsa bareki.Re reka likarolo tsohle tsa BOM ho tsoa ho moemeli oa pele oa feme ea mantlha, joalo ka Future, Arrow, Espressif, Antenova, Wasun, ICKey, Digikey, Qucetel, le U-blox, ho boloka boleng.Re ka u ts'ehetsa sethaleng sa moralo le nts'etsopele ho fana ka likeletso tsa tekheniki mabapi le ts'ebetso ea tlhahiso, ntlafatso ea lihlahisoa, li-prototypes tse potlakileng, ntlafatso ea liteko le tlhahiso ea bongata.Re tseba ho haha ​​li-PCB ka mokhoa o nepahetseng oa tlhahiso.


Lintlha tsa Tšebeletso

Li-tag tsa litšebeletso

Tlhaloso

Re na le lisebelisoa tsa SPI, AOI, le X-ray bakeng sa mela e 20 ea SMT, 8 DIP, le mela ea teko, re fana ka tšebeletso e tsoetseng pele e kenyelletsang mekhoa e mengata ea ho kopanya le ho hlahisa PCBA ea mekhahlelo e mengata, PCBA e tenyetsehang.Laeborari ea rona ea litsebi e na le ROHS, drop, ESD, le lisebelisoa tse phahameng le tse tlase tsa tlhahlobo ea mocheso.Lihlahisoa tsohle li fetisoa ka taolo e tiileng ea boleng.Re sebelisa sistimi e tsoetseng pele ea MES bakeng sa taolo ea tlhahiso tlasa maemo a IAF 16949, re sebetsana le tlhahiso ka nepo le ka polokeho.
Ka ho kopanya lisebelisoa le baenjiniere, re ka boela ra fana ka tharollo ea lenaneo, ho tloha ho nts'etsopele ea lenaneo la IC le software ho ea ho moralo oa potoloho ea motlakase.Ka boiphihlelo ba ho nts'etsapele merero ea tlhokomelo ea bophelo bo botle le lisebelisoa tsa elektroniki tsa bareki, re ka nka maikutlo a hau mme ra tlisa sehlahisoa sa nnete bophelong.Ka ho hlahisa software, lenaneo, le boto ka boeona, re ka laola ts'ebetso eohle ea tlhahiso ea boto, hammoho le lihlahisoa tsa ho qetela.Ka lebaka la feme ea rona ea PCB le baenjiniere, e re fa melemo ea tlholisano ha e bapisoa le feme e tloaelehileng.Ho ipapisitsoe le moralo oa sehlahisoa le sehlopha sa nts'etsopele, mokhoa o hlophisitsoeng oa tlhahiso ea bongata bo fapaneng, le puisano e sebetsang lipakeng tsa ketane ea phepelo, re na le ts'epo ea ho tobana le mathata le ho etsa hore mosebetsi o etsoe.

Bokhoni ba PCBA

Thepa e ikemetseng

Tlhaloso

Mochini oa ho tšoaea oa laser PCB500

Lethathamo la matšoao: 400 * 400mm
Lebelo: ≤7000mm/S
Matla a phahameng: 120W
Q-switching, Karo-karolelano ea mosebetsi: 0-25KHZ;0-60%

Mochine oa khatiso oa DSP-1008

PCB boholo: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm
Boholo ba Stencil: MAX: 737 * 737mm
MIN:420*520mm
Khatello ea scraper: 0.5 ~ 10Kgf / cm2
Mokhoa oa ho hloekisa: Ho hloekisa ka mokhoa o omileng, ho hloekisa ka metsi, ho hloekisa li-vacuum (ho ka khoneha)
Lebelo la ho hatisa: 6 ~ 200mm / sec
Ho nepahala ha khatiso: ± 0.025mm

SPI

Molao-motheo oa ho lekanya: 3D White Light PSLM PMP
Ntho ea tekanyo: bophahamo ba molumo oa solder, sebaka, bophahamo, XY offset, sebopeho
Qeto ea lense: 18um
Ho nepahala: Qeto ea XY: 1um;
Lebelo le phahameng: 0.37um
Boima ba pono: 40 * 40mm
Lebelo la FOV: 0.45s/FOV

Mochini oa lebelo o phahameng oa SMT SM471

PCB boholo: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm
Palo ea li-shafts tse ntseng li eketseha: 10 spindles x 2 cantilevers
Boholo ba motsoako: Chip 0402(01005 inch) ~ □14mm(H12mm) IC,Sehokelo(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Ho phahamisa ho nepahala: chip ± 50um@3ó/chip, QFP ± 30um@3ó/chip
Lebelo la ho phahamisa: 75000 CPH

Mochini oa lebelo o phahameng oa SMT SM482

PCB boholo: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm
Palo ea li-shafts tse ntseng li eketseha: 10 spindles x 1 cantilever
Boholo ba karolo: 0402(01005 inch) ~ □16mm IC,Sehokelo(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Ho nepahala ha ho hlongoa: ±50μm@μ+3σ (ho ea ka boholo ba chip e tloaelehileng)
Lebelo la ho phahamisa: 28000 CPH

HELLER MARK III Sebopi sa naetrojene reflux

Sebaka: libaka tse 9 tsa ho futhumatsa, libaka tse 2 tse pholileng
Mohloli oa mocheso: Ho tsamaisa moea o chesang
Ho nepahala ha taolo ea mocheso: ± 1℃
Matla a matšeliso a mocheso: ±2℃
Lebelo la Orbital: 180-1800mm / min
Bophara ba pina: 50—460mm

AOI ALD-7727D

Molao-motheo oa ho lekanya: Khamera ea HD e fumana boemo bo bonahatsang karolo ka 'ngoe ea khanya ea mebala e meraro e khantšang holim'a boto ea PCB, 'me e e ahlole ka ho bapisa setšoantšo kapa ts'ebetso e utloahalang ea boleng bo bohlooho le ba RGB ba ntlha e' ngoe le e 'ngoe ea pixel.
Ntho ea tekanyo: Mefokolo ea khatiso ea solder, likaroloana, liphoso tse kopantsoeng tsa solder
Qeto ea lense: 10um
Ho nepahala: Qeto ea XY: ≤8um

Tlhaloso: 3D X-RAY AX8200MAX

Boholo ba boholo ba ho lemoha: 235mm * 385mm
Matla a phahameng: 8W
Boholo ba matla: 90KV/100KV
Boholo ba maikutlo: 5μm
Polokeho (lethal dose la mahlaseli): <1uSv/h

Wave soldering DS-250

PCB bophara: 50-250mm
PCB phetiso bophahamo: 750 ± 20 limilimithara
Lebelo la phetisetso: 0-2000mm
Bolelele ba sebaka sa preheating: 0.8M
Palo ea sebaka sa preheating: 2
Nomoro ea wave: Dual wave

Mochini oa ho arola boto

Sebaka sa ho sebetsa: MAX: 285 * 340mm MIN: 50 * 50mm
Ho itšeha ka nepo: ± 0.10mm
Lebelo la ho itšeha: 0 ~ 100mm/S
Lebelo la ho potoloha ha spindle: MAX: 40000rpm

Bokhoni ba Theknoloji

Nomoro

Ntho

Bokhoni bo boholo

1

thepa ea motheo Tg e Tlwaelehileng FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df jj.

2

'Mala oa mask oa solder botala, bofubedu, boputswa, bosweu, bosehla, bopherese, botsho

3

'Mala oa tšōmo e tšoeu, e mosehla, e ntšo, e khubelu

4

Mofuta oa phekolo ea holim'a metsi ENIG, Immersion tin, HAF, HAF LF, OSP, khauta e khanyang, monoana oa khauta, silevera e ntle

5

Max.kaho(L) 50

6

Max.boholo ba yuniti (mm) 620*813 (24"*32")

7

Max.boholo ba phanele e sebetsang (mm) 620*900 (24"x35.4")

8

Max.botenya ba boto (mm) 12

9

Min.botenya ba boto(mm) 0.3

10

Botenya ba boto (mm) T<1.0 limilimithara: +/-0.10mm ;T≥1.00mm: +/-10%

11

Mamello ea ngoliso (mm) +/-0.10

12

Min.bophara ba lesoba la ho cheka ka mochini (mm) 0.15

13

Min.bophara ba lesoba la laser(mm) 0.075

14

Max.karolo (ka lesoba) 15:1
Max.karolo (micro-via) 1.3:1

15

Min.moeli oa lesoba ho sebaka sa koporo(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3

16

Min.tumello ea kahare(mm) 0.15

17

Min.Molomo oa lesoba ho isa moeling oa lesoba(mm) 0.28

18

Min.Lekhalo la lesoba sebakeng sa mohala oa profil(mm) 0.2

19

Min.koporo ea kahare ho ea ho profil line sapce (mm) 0.2

20

Mamello ea ngoliso lipakeng tsa masoba (mm) ±0.05

21

Max.botenya ba koporo bo felileng Lera le ka ntle: 420 (12oz)
Lera ka Hare: 210 (6oz)

22

Min.trace wide (mm) 0.075 (3mil)

23

Min.sebaka sa ho latela (mm) 0.075 (3mil)

24

Botenya ba mask a solder (um) huku ea mohala: >8 (0.3mil)
holim'a koporo: >10 (0.4mil)

25

ENIG botenya ba khauta (um) 0.025-0.125

26

ENIG botenya ba nickle (um) 3-9

27

Botenya ba silevera ea Sterling (um) 0.15-0,75

28

Min.HAL botenya ba thini (um) 0.75

29

Botenya ba tin (um) 0.8-1.2

30

Botenya ba khauta bo botenya bo botenya ba khauta (um) 1.27-2.0

31

botenya ba khauta ea monoana oa khauta (um) 0.025-1.51

32

botenya ba nickle botenya ba monoana oa khauta oa khauta 3-15

33

botenya ba khauta e phatsimang (um) 0,025-0.05

34

botenya ba nickle ea khauta e phatsimang (um) 3-15

35

mamello ea boholo ba profaele (mm) ±0.08

36

Max.solder mask plugging lesoba size (mm) 0.7

37

BGA pad (mm) ≥0.25 (HAL kapa HAL Mahala:0.35)

38

Mamello ea boemo ba V-CUT (mm) +/-0.10

39

Mamello ea boemo ba V-CUT (mm) +/-0.10

40

Tolerance angle ea khauta ea monoana (o) +/-5

41

Boikutlo ba ho impedence (%) +/-5%

42

Mamello ea li-warpage (%) 0.75%

43

Min.bophara ba tšōmo (mm) 0.1

44

Lelakabe la mollo le kokobela 94V-0

E khethehileng bakeng sa lihlahisoa tsa Via ka pad

Resin e kentsoeng ka boholo ba lesoba (min.) (mm) 0.3
Boholo ba lesoba le kentsoeng resin (boholo bo boholo) (mm) 0.75
Botenya ba boto e kentsoeng ka resin (min.) (mm) 0.5
Botenya ba boto e kentsoeng ka resin (max.) (mm) 3.5
Resin e kenyellelitsoeng boholo ba likarolo tse kholo 8:1
Resin e hoketsoe lesoba le bonyane sebakeng sa lesoba (mm) 0.4
Na ho ka fapana boholo ba lesoba botong e le 'ngoe? ho joalo

Boto ea sefofane e ka morao

Ntho
Max.boholo ba pnl (e felile) (mm) 580*880
Max.boholo ba phanele e sebetsang (mm) 914 × 620
Max.botenya ba boto (mm) 12
Max.kaho(L) 60
Karolo 30:1 (Mosoba o Min.: 0.4 mm)
Bophara ba mola/sebaka (mm) 0.075/ 0.075
Bokhoni ba ho cheka ka morao Ee
Mamello ea ho cheka mokokotlo (mm) ±0.05
Mamello ea masoba a tobetsang (mm) ±0.05
Mofuta oa phekolo ea holim'a metsi OSP, silevera e ntle, ENIG

Boto e thata-flex

Boholo ba lesoba (mm) 0.2
Botenya ba dielectrical (mm) 0.025
Boholo ba Panel e sebetsang (mm) 350 x 500
Bophara ba mola/sebaka (mm) 0.075/ 0.075
Stiffener Ee
Flex board layers (L) 8 (4plys of flex board)
Mekhahlelo e thata ea boto (L) ≥14
Phekolo ea bokaholimo Tsohle
Flex board e bohareng kapa ka ntle Ka bobeli

E khethehileng bakeng sa lihlahisoa tsa HDI

Boholo ba lesoba la ho cheka ka laser (mm)

0.075

Max.botenya ba dielectric (mm)

0.15

Min.botenya ba dielectric (mm)

0.05

Max.karolo

1.5:1

Boholo ba Pad e tlase (tlasa micro-via) (mm)

Boholo ba lesoba +0,15

Saese e ka hodimo ya Pedi (ho micro-via) (mm)

Boholo ba lesoba +0,15

Ho tlatsa koporo kapa che (ee kapa che) (mm)

ho joalo

Ka moralo oa Pad kapa che (e kapa che)

ho joalo

Resin e patiloeng e kentsoeng (e kapa che)

ho joalo

Min.ka boholo bo ka tlatsoa ka koporo (mm)

0.1

Max.linako tsa stack

lera lefe kapa lefe

  • E fetileng:
  • E 'ngoe: