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EMS mhinduro dzePrinted Circuit Board

Wako EMS shamwari yeJDM, OEM, uye ODM mapurojekiti.

EMS mhinduro dzePrinted Circuit Board

Semubatsiri wemagetsi ekugadzira sevhisi (EMS), Minewing inopa JDM, OEM, uye ODM masevhisi kune vatengi vepasi rese kugadzira bhodhi, sebhodhi rinoshandiswa padzimba dzakangwara, zvidzoreso zvemaindasitiri, zvinopfekwa, mabhekoni, uye zvemagetsi zvevatengi.Isu tinotenga zvese zvikamu zveBOM kubva kune yekutanga fekitori mumiriri, senge Future, Arrow, Espressif, Antenova, Wasun, ICKey, Digikey, Qucetel, uye U-blox, kuchengetedza mhando.Isu tinogona kukutsigira iwe padanho rekugadzira uye kusimudzira kuti tikupe zano rehunyanzvi pamaitiro ekugadzira, kugadzirisa chigadzirwa, kukurumidza prototypes, kuyedza kuvandudza, uye kugadzirwa kwakawanda.Isu tinoziva maitiro ekuvaka maPCB neakakodzera maitiro ekugadzira.


Service Detail

Service Tags

Tsanangudzo

Takashongedzerwa neSPI, AOI, uye X-ray mudziyo wemitsara makumi maviri yeSMT, 8 DIP, uye mitsara yekuyedza, tinopa sevhisi yemhando yepamusoro inosanganisira nzira dzakasiyana siyana dzemagungano uye kugadzira akawanda-layers PCBA, inochinjika PCBA.Yedu nyanzvi marabhoritari ine ROHS, kudonha, ESD, uye yakakwira & yakaderera tembiricha yekuyedza michina.Zvese zvigadzirwa zvinounzwa nekuomesera kwemhando yekudzora.Tichishandisa iyo yepamusoro MES sisitimu yekugadzira manejimendi pasi peIAF 16949 yakajairwa, isu tinobata kugadzirwa zvakanaka uye zvakachengeteka.
Nekubatanidza zviwanikwa uye mainjiniya, tinogona zvakare kupa mhinduro dzechirongwa, kubva kuIC chirongwa chekuvandudza uye software kusvika kumagetsi edunhu dhizaini.Tine ruzivo mukugadzira mapurojekiti mune zvehutano uye zvemagetsi zvevatengi, tinogona kutora mazano ako uye kuunza chigadzirwa chaicho kuhupenyu.Nekugadzira software, chirongwa, uye bhodhi pachayo, isu tinokwanisa kubata iyo yose yekugadzira maitiro ebhodhi, pamwe chete nezvigadzirwa zvekupedzisira.Kutenda kune yedu PCB fekitori uye mainjiniya, inotipa mabhenefiti emakwikwi kana achienzaniswa neyakajairwa fekitori.Zvichienderana nedhizaini yekugadzira & timu yekusimudzira, iyo yakagadzwa yekugadzira nzira yehuwandu hwakasiyana, uye kutaurirana kunoshanda pakati peiyo ketani yekugovera, isu tine chivimbo chekutarisana nematambudziko uye kuita kuti basa riitwe.

PCBA Kugona

Automatic equipment

Tsanangudzo

Laser yekumaka muchina PCB500

Kuisa chiratidzo: 400 * 400mm
Kumhanya: ≤7000mm/S
Maximum simba: 120W
Q-kuchinja, Duty Ratio: 0-25KHZ;0-60%

Kuprinda muchina DSP-1008

PCB saizi: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm
Stencil size: MAX: 737 * 737mm
MIN:420*520mm
Scraper pressure: 0.5 ~ 10Kgf/cm2
Nzira yekuchenesa: Dry kuchenesa, kuchenesa mvura, vacuum kuchenesa (inorongwa)
Kudhinda kumhanya: 6 ~ 200mm/sec
Kudhinda nemazvo: ± 0.025mm

SPI

Kuyeresa musimboti: 3D White Chiedza PSLM PMP
Chiyero chinhu: Solder paste vhoriyamu, nzvimbo, kureba, XY offset, chimiro
Lens kugadzirisa: 18um
Kururamisa: XY kugadziriswa: 1um;
High kumhanya: 0.37um
Kutarisa chiyero: 40 * 40mm
FOV kumhanya: 0.45s/FOV

High kumhanya SMT muchina SM471

PCB saizi: MAX:460*250mm MIN:50*40mm T:0.38~4.2mm
Nhamba yekusimudza shafts: 10 spindles x 2 cantilevers
Saizi yechikamu: Chip 0402(01005 inch) ~ □14mm(H12mm) IC,Chibatanidza(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Kukwira chaiko: chip ±50um@3ó/chip, QFP ±30um@3ó/chip
Kumhanyisa kumhanya: 75000 CPH

High kumhanya SMT muchina SM482

PCB saizi: MAX:460*400mm MIN:50*40mm T:0.38~4.2mm
Nhamba yekusimudza shafts: 10 spindles x 1 cantilever
Saizi yechikamu: 0402(01005 inch) ~ □16mm IC,Chibatanidza(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Kukwira chaiko: ± 50μm@μ+3σ (maererano nehukuru hwechip)
Kumhanyisa kumhanya: 28000 CPH

HELLER MARK III Nitrogen reflux choto

Zone: 9 yekudziya nzvimbo, 2 yekutonhora nzvimbo
Heat source: Heat convection
Kunyatso kudzora tembiricha: ± 1℃
Thermal muripo wesimba: ± 2 ℃
Orbital kumhanya: 180-1800mm / min
Track hupamhi: 50-460mm

AOI ALD-7727D

Kuyeresa musimboti: Iyo HD kamera inowana ratidziro yechikamu chega chega chetatu-ruvara mwenje inovhenekera paPCB board, uye inoitonga nekufananidza mufananidzo kana zvine musoro kushanda kwegrey uye RGB kukosha kwepixel point yega yega.
Chiyero chechinhu: Solder paste kudhinda kuremara, zvikamu zvakakanganisika, solder joint kukanganisa
Lens kugadzirisa: 10um
Kururamisa: XY resolution: ≤8um

3D X-RAY AX8200MAX

Saizi yepamusoro yekuona: 235mm * 385mm
Maximum simba: 8W
Maximum voltage: 90KV/100KV
Saizi yekutarisa: 5μm
Kuchengeteka (mwaranzi dose): <1uSv/h

Wave soldering DS-250

PCB upamhi: 50-250mm
PCB kutapurirana kureba: 750 ± 20 mm
Kufambisa kumhanya: 0-2000mm
Hurefu hwe preheating zone: 0.8M
Nhamba ye preheating zone: 2
Wave nhamba: Dual wave

Board splitter muchina

Basa rekushanda: MAX: 285 * 340mm MIN: 50 * 50mm
Kucheka chaiko: ± 0.10mm
Kucheka kumhanya: 0 ~ 100mm/S
Kumhanya kwekutenderera kwe spindle: MAX: 40000rpm

Technology Kugona

Number

Item

Kugona kukuru

1

base material Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df nezvimwe.

2

Solder mask ruvara green, red, blue, white, yellow, purple, black

3

Legend color chena, yero, nhema, tsvuku

4

Pamusoro pekurapa mhando ENIG, Immersion tin, HAF, HAF LF, OSP, goridhe rinopenya, chigunwe chegoridhe, sirivha inopenya

5

Max.layer-up(L) 50

6

Max.saizi yeyuniti (mm) 620*813 (24"*32")

7

Max.saizi yepaneru yekushanda (mm) 620*900 (24"x35.4")

8

Max.bhodhi ukobvu (mm) 12

9

Min.bhodhi ukobvu(mm) 0.3

10

Bhodhi ukobvu kushivirira (mm) T<1.0 mm: +/-0.10mm ;T≥1.00mm: +/-10%

11

Kunyoresa kushivirira (mm) +/-0.10

12

Min.Mechini yekuchera gomba dhayamita (mm) 0.15

13

Min.Laser kuchera gomba dhayamita(mm) 0.075

14

Max.chikamu (kuburikidza neburi) 15:1
Max.chikamu (micro-via) 1.3:1

15

Min.gomba kumucheto kune nzvimbo yemhangura (mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3;

16

Min.Innerlay clearance(mm) 0.15

17

Min.gomba kumucheto kune gomba kumucheto nzvimbo (mm) 0.28

18

Min.gomba kumucheto kune profile line nzvimbo (mm) 0.2

19

Min.Innerlay mhangura kune profile line sapce (mm) 0.2

20

Kunyoresa kushivirira pakati pemakomba (mm) ±0.05

21

Max.kupera kwemhangura ukobvu(um) Musara Wekunze: 420 (12oz)
Mukati memukati: 210 (6oz)

22

Min.trace wide (mm) 0.075 (3mil)

23

Min.nzvimbo yekutsvaga (mm) 0.075 (3mil)

24

Solder mask ukobvu (um) mutsara kona: > 8 (0.3mil)
pamhangura: >10 (0.4mil)

25

ENIG goridhe ukobvu (um) 0.025-0.125

26

ENIG nickle ukobvu (um) 3-9

27

Sterling sirivheri ukobvu (um) 0.15-0.75

28

Min.HAL tini ukobvu (um) 0.75

29

Kunyudza tin ukobvu (um) 0.8-1.2

30

Goridhe yakaoma-gobvu inoisa goridhe ukobvu (um) 1.27-2.0

31

chigunwe chegoridhe chinoisa ukobvu hwegoridhe (um) 0.025-1.51

32

chigunwe chegoridhe chinoisa nickle ukobvu(um) 3-15

33

goridhe rinopenya goridhe ukobvu (um) 0,025-0.05

34

flash goridhe plating nickle ukobvu (um) 3-15

35

Profile saizi kushivirira (mm) ±0.08

36

Max.solder mask plugging gomba size (mm) 0.7

37

BGA padhi (mm) ≥0.25 (HAL kana HAL Yemahara:0.35)

38

V-CUT blade chinzvimbo kushivirira (mm) +/-0.10

39

V-CUT kushivirira chinzvimbo (mm) +/-0.10

40

Gold finger bevel angle tolerance (o) +/-5

41

Impedence kushivirira (%) +/-5%

42

Warpage kushivirira (%) 0.75%

43

Min.upamhi hwengano (mm) 0.1

44

Moto unopisa 94V-0

Yakakosha yeVia mune zvigadzirwa zvepadhi

Resin yakavharwa gomba saizi (min.) (mm) 0.3
Resin yakavharwa gomba size (max.) (mm) 0.75
Resin plugged board ukobvu (min.) (mm) 0.5
Resin plugged board ukobvu (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin yakabairwa buri shoma paburi renzvimbo (mm) 0.4
Unogona here kusiyanisa saizi yegomba mubhodhi rimwe? Ehe

Back plane board

Item
Max.pnl size (yapera) (mm) 580*880
Max.saizi yepaneru yekushanda (mm) 914 × 620
Max.bhodhi ukobvu (mm) 12
Max.layer-up(L) 60
Aspect 30:1 (Min. gomba: 0.4 mm)
Mutsetse wakafara/nzvimbo (mm) 0.075/ 0.075
Back drill kugona Ehe
Kushivirira kwekuchera kumashure (mm) ±0.05
Kushivirira kwemaburi anokodzera maburi (mm) ±0.05
Pamusoro pekurapa mhando OSP, sirivheri yakanaka, ENIG

Rigid-flex board

Hukuru hwegomba (mm) 0.2
Dielectrical ukobvu (mm) 0.025
Saizi yePaneru yekushanda (mm) 350 x 500
Mutsetse wakafara/nzvimbo (mm) 0.075/ 0.075
Stiffener Ehe
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Kurapa kwepamusoro Zvose
Flex board iri pakati kana yekunze layer Zvose

Yakakosha kune HDI zvigadzirwa

Laser kuchera gomba saizi (mm)

0.075

Max.Dielectric ukobvu (mm)

0.15

Min.Dielectric ukobvu (mm)

0.05

Max.chimiro

1.5:1

Padhi Padhi saizi (pasi pemicro-via) (mm)

Gomba saizi+0.15

Pamusoro Pedhi saizi (pamicro-via) (mm)

Gomba saizi+0.15

Mhangura yekuzadza kana kwete (hongu kana kwete) (mm)

Ehe

Via muPad dhizaini kana kwete (hongu kana kwete)

Ehe

Yakavigwa gomba resin yakavharwa (hongu kana kwete)

Ehe

Min.kuburikidza nehukuru inogona kuzadzwa nemhangura (mm)

0.1

Max.stack nguva

chero layer

  • Zvakapfuura:
  • Zvinotevera: